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This Test Method does not cover measurements in the wafer edge profile
従って，セキュリティ対策は半導体製造装置の不可避な要件となっている。
SEMI E5-0712 (technical revision)
This Test Method may be used by lead frame manufacturers at outgoing inspection and by users at incoming inspection
2-1016 (Reapproved 0224)
G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds Revision:SEMI G15-93 - Superseded This Test Method does notNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Document describes procedures for evaluating epoxy molding compounds by differential scanning calorimetry (DSC). This test method uses SI units. Referenced SEMI Standards (purchase separately) None. Revision History