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2 The specifications for epitaxial silicon wafers for integrated circuit applications are restricted to wafers of diameter of 100 mm or greater with epitaxial layer thickness less than or equal to 25 µm
SEMI G41-87 (first published)
本安全基準之目的係在設定半導體、FPD、PV製造及其他使用易燃性矽化合物製程設備之最低安全與衛生設計標準。
SEMI S1-0923a (delayed revision)
1 The purpose of this Specification is to define a standard equipment capability to report recipe step and process-related data to the factory system
E10900 - SEMI E109 - レチクルおよびポッド管理に関する仕様(RPMS) StdPbc-1224 2 The specifications for epitaxialGlobal Information & Control CommitteeNorth American Information & Control Committee20041210North American Regional Standards Committee20052www. semi. org2005320017200411 ReticleID AMHS ID Subordinate Document: SEMI E109. 1 0704 PODRPMSSEC II Referenced SEMI Standards SEMI E5 SEMI Equipment Communications Standard 2 Message Content (SECS II) SEMI E15 Specification for Tool Load port SEMI E30 Generic Model for Communications and Control of SEMI
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